HDI PCB-Automobile technical capability | |||||||
Items | 2024 | 2025 | 2026 | ||||
volume | sample | volume | sample | volume | sample | ||
Layer count | ≤24L | ≤36L | ≤24L | ≤36L | ≤24L | ≤36L | |
Stack-up | 3+N+3 | 4+N+4 | 4+N+4 | Anylayer(10L) | Anylayer(10L) | Anylayer(12L) | |
Dimension(mm) | MAX | 620*725mm | 620*810mm | 620*725mm | 620*1092mm | 620*725mm | 620*1092mm |
Board thickness(mm) | MAX | 3.2mm | 4.2mm | 3.2mm | 4.2mm | 3.2mm | 4.2mm |
lmpedance tolerance | Diff>50ohm | 土10% | 土7% | 土10% | 土7% | 土8% | 土7% |
single 50ohm | 土10% | 土8% | 土8% | 土6% | 土8% | 土6% | |
Layer registration | ≤12L | ≥5mil | ≥4mil | ≥5mil | ≥4mil | ≥4mil | ≥3mil |
>12L | ≥7mil | ≥5mil | ≥6mil | ≥5mil | ≥5mil | ≥4mil | |
N+N | ≥7mil | ≥5mil | ≥7mil | ≥5mil | ≥5mil | ≥4mil | |
Pattern accuracy | ≤500mm | ±4mil | ±4mil | ±4mil | ±4mil | ±4mil | ±4mil |
>500mm | ±5mil | ±5mil | ±5mil | ±5mil | ±5mil | ±5mil | |
Laser blind hole | 100/225um | 75/200um | 75/200um | 75/180um | 75/180um | 65/165um | |
Dimple | 25um | 15um | 20um | 10um | 20um | 10um | |
Plating aspect ratio for via hole | 14:1 | 16:1 | 14:1 | 16:1 | 14:1 | 16:1 | |
Back- drill | Back-drill size (min) | 0.45mm | 0.4mm | 0.45mm | 0.4mm | 0.4mm | 0.35mm |
STUB (min) | 8mil | 6mil | 8mil | 6mil | 6mil | 5mil | |
Back-drill to copperdistance (min) | 7mil | 5mil | 7mil | 5mil | 5mil | 5mil | |
Special technology | POFV | yes | yes | yes | yes | yes | yes |
N+N | yes | yes | yes | yes | yes | yes | |
Hybrid lamination | yes | yes | yes | yes | yes | yes | |
Blind hole | yes | yes | yes | yes | yes | yes | |
Metallized half hole | yes | yes | yes | yes | yes | yes | |
FLEX technical capability | ||||||||
Items | 2024 | 2025 | 2026 | remark | ||||
volume | sample | volume | sample | volume | sample | |||
Material | Flexible substrate | Non-adhesive substrate, | Non-adhesive substrate, | Non-adhesive substrate, |
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Stiffener | PI、FR4、 steel、Aluminium | PI、FR4、 steel、Aluminium | PI、FR4、 steel、Aluminium |
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PP | Epoxy glue, acrylic glue | Epoxy glue, acrylic glue | Epoxy glue, acrylic glue |
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Covering film | Epoxy glue, acrylic glue | Epoxy glue, acrylic glue | Epoxy glue, acrylic glue |
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Layers | Flexible | 4L | 6L | 8L |
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Thickness | Finished | Min 0.03mm | Min 0.03mm | Min 0.03mm | 1L FLEX | |||
Tolerance | Min ±0.015mm | Min ±0.015mm | Min ±0.015mm |
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Finished copper | Inner copper | 1/3-1oZ | 1/3-2oZ | 1/3-2oZ | Base copper thickness | |||
Outer copper | 1/3-2oZ | 1/3-3oZ | 1/3-3oZ | Base copper thickness | ||||
Dimension | Min | 20mm*20mm | 10mm*10mm | 5mm*5mm |
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Max | 500mm*610mm | 500mm*610mm | 500mm*610mm |
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Trace width/distance | Inner layer | 2mil/2mil | 2mil/2mil | 1.8mil/1.8mil | Finished copper 0.5oZ | |||
Outer layer | 2mil/2mil | 2mil/2mil | 1.8mil/1.8mil | Finished copper 1oZ | ||||
Finished hole | Drilling | Min 0.1mm | Min 0.1mm | Min 0.1mm |
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Laser drilling | Min 0.075mm | Min 0.075mm | Min 0.05mm |
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Thickness to diameter | Drilling | Max 1:1 | Max 1:1 | Max 1:1 |
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Laser drilling | Max 12:1 | Max 15:1 | Max 15:1 |
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Dielectric thickness | Flexible core | Min 0.0125mm | Min 0.0125mm | Min 0.0125mm |
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Dimensional tolerance | Laser cutting | ±0.05mm | ±0.05mm | ±0.05mm | UV Laser cutting
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Die-cutting | Min 0.05mm | Min 0.05mm | Min 0.05mm | Slow wire die cutting | ||||
Rigid-FLEX technical capability | |||||||
Items | units | 2024 | 2025 | 2026 | |||
volume | sample | volume | sample | volume | sample | ||
Medium thickness(FLEX ) | mm | 0.025~0.10 | 0.025~0.15 | 0.025~0.15 | 0.013~0.15 | 0.013~0.15 | 0.013~0.15 |
Surface smoothness | um | 50 | 50 | 50 | 30 | 30 | 30 |
Min distance hole to Window | mm | 0.8 | 0.5 | 0.5 | 0.4 | 0.4 | 0.4 |
Min distance trace to Window | mm | 0.4 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
Window Excess glue | mm | 1.00 | 0.5 | 0.5 | 0.3 | 0.3 | 0.3 |
Min window width | mm | 3.5 | 3 | 3 | 2.6 | 2.6 | 2.6 |
FLEX finished copper | oZ | 0.5-2 | 0.5-2 | 0.33-2 | 0.33-2 | 0.33-2 | 0.33-2 |
Rigid finished copper | oZ | 0.5-4 | 0.33-4 | 0.33-4 | 0.33-4 | 0.33-4 | 0.33-4 |
Min trace width/distance | mm | 0.075/0.075 | 0.06/0.06 | 0.05/0.05 | 0.05/0.05 | 0.05/0.05 | 0.04/0.04 |
Min thickness | mm | 0.35 | 0.3 | 0.3 | 0.25 | 0.25 | 0.25 |
Impedance | % | ±10 | ±10 | ±8 | ±7 | ±7 | ±5 |
Warping | % | ≤0.75 | ≤0.50 | ≤0.75 | ≤0.50 | ≤0.50 | ≤0.50 |
Min finished PTH | mm | 0.15 | 0.1 | 0.15 | 0.1 | 0.1 | 0.1 |
Depth milling | mm | ±0.075 | ±0.075 | ±0.075 | ±0.075 | ±0.075 | ±0.075 |
HDI-RF laser step | / | 2step | 3step | 2step | 3step | 3step | 3step |
FLEX quantity (hinge) | / | ≤4 | ≤6 | ≤6 | ≤8 | ≤8 | ≤10 |
FLEX quantity(bonding) | / | ≤2 | ≤2 | ≤2 | ≤2 | ≤2 | ≤2 |